| 摘要 |
PROBLEM TO BE SOLVED: To improve throughput in a developing device. SOLUTION: The developing device comprises: a pair of turning bodies 41, 42 that rotates around a horizontal axis and is arranged in front and behind so that the rotating axes become parallel each other; a conveyance path member 4 bridges the rotating bodies 41, 42 and moves along an orbit and forms a conveyance path for a wafer W placed on the conveyance path member; a carry-in delivery section 31 provided at the upstream end of the conveyance path; a carry-out delivery section 32 provided at the downstream end of the conveyance path; and a developer nozzle 71 supplying a developer to the wafer W from the upstream side successively, a cleaning liquid nozzle 72 supplying a cleaning liquid to the wafer W, and a gas nozzle 74 supplying gas to the wafer W, which are provided between the upstream end and the downstream end of the conveyance path. COPYRIGHT: (C)2009,JPO&INPIT
|
