| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a dicing frame that prevents defects due to the occurrence of vertical burrs without causing troubles in suction due to gas leakage through a gap occurring between a vertical-burr suppression counterbore part and a suction pad during suction by the suction pad, and a dicing frame. SOLUTION: In the dicing-frame manufacturing method, a hollow dicing frame 1, which is used for a semiconductor wafer and sucked by a vacuum suction pad, is injection-molded by injecting a molding material including a resin into a mold, and then, the dicing frame 1 is demolded by ejector pins 53 of the mold after opening the mold. When injection-molding the dicing frame 1, each molding-material reservoir part 9, with which each ejector pin 53 interferes, is juxtaposed at the inner/outer peripheral edge parts of the dicing frame 1. Each molding-material reservoir part 9 is removed from the dicing frame 1 after demolding the dicing frame 1. Since it is not necessary to mold a vertical-burr suppression counterbore part, it does not cause troubles in vacuum suction due to air leakage caused by the occurrence of a gap between a vertical-burr suppression counterbore part and a vacuum suction pad. COPYRIGHT: (C)2009,JPO&INPIT
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