| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an imaging module which is incorporated in an electronic apparatus such as an imaging lens unit, in which the heat of an image sensor is efficiently cooled by use of a heat pipe, and which can be assembled easily and is compactible. <P>SOLUTION: An image sensor module 3 incorporated in an imaging lens unit 1 is mounted on a connection FPC 31. The image sensor module 3 includes an image sensor 13 which can be moved on an XY plane and which is supported on an image sensor supporting plate 15, a heat absorbing heat pipe 16 arranged on the vicinity at a non-imaging surface side of the imaging device 13, and an extensible connection pipe 18 for connecting the heat absorbing heat pipe 16 and a heat emitting heat pipe 17 at an imaging module support 11 side. The image sensor supporting plate 15 is formed of a material the heat conductivity of which is high. A heat pipe fixing concavity 15c is formed on the upper surface of the image sensor side. The heat absorbing heat pipe 16 is fixed onto the concavity. An open space concavity 15b is formed near a place where the heat absorbing heat pipe 16 is arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
