发明名称 |
Enhanced Mechanical Strength Via Contacts |
摘要 |
The present invention provides an enhanced interconnect structure with improved reliability. The inventive interconnect structure has enhanced mechanical strength of via contacts provided by embedded metal liners. The embedded metal liners may be continuous or discontinuous. Discontinuous embedded metal liners are provided by a discontinuous interface at the bottom of the via located within the interlayer dielectric layer.
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申请公布号 |
US2008280434(A1) |
申请公布日期 |
2008.11.13 |
申请号 |
US20080179054 |
申请日期 |
2008.07.24 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
YANG CHIH-CHAO;BONILLA GRISELDA;CHEN SHYNG-TSONG;MALONE KELLY |
分类号 |
H01L21/4763 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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