发明名称 SOLVENTLESS SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a silicone pressure-sensitive adhesive composition that contains no organic solvent, can prevent the absorption of ultraviolet radiation or the like, the contamination on electronic/electrical components, adverse effects on human body and skin irritation caused by residual and volatile substances, can easily be removed without deforming or damaging an adherend and has appropriately adjusted adhesive strength. SOLUTION: The solventless silicone pressure-sensitive adhesive composition comprises (A) a polyorganosiloxane having at least two alkenyl group-containing organic groups in a molecule with a polymerization degree of 300-2,000, (B) a polyorganohydrosiloxane having at least three SiH groups in a molecule, (C) a polydiorganosiloxane having alkenyl groups at both terminals with a polymerization degree of 3-22, (D) a polydiorganosiloxane having SiH groups only at both terminals, (E) a polyorganosiloxane composed of a R<SP>2</SP><SB>3</SB>SiO<SB>1/2</SB>unit and an SiO<SB>2</SB>unit (wherein R<SP>2</SP>is a monovalent hydrocarbon group), and (F) a platinum-based catalyst. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008274251(A) 申请公布日期 2008.11.13
申请号 JP20080087267 申请日期 2008.03.28
申请人 SHIN ETSU CHEM CO LTD 发明人 AOKI SHUNJI
分类号 C09J183/04 主分类号 C09J183/04
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