发明名称 SEMI-AROMATIC POLYAMIDE MOLDING COMPOSITION AND ITS USE
摘要 <P>PROBLEM TO BE SOLVED: To provide an improved polyamide molding composition superior to the prior art in terms not only of mechanical characteristics under wet or moist conditions but also of processability, a molded product containing the molding composition as a main component, and a method for preparing the molding composition. <P>SOLUTION: The polyamide molding composition contains (A) a 30-100 mass% of at least one 10T/6T copolyamide comprising (A1) a 40-95 mol% 10T unit formed of 1, 10-decanediamine monomer and terephthalic acid and (A2) a 5-60 mol% 6T unit formed of 1,6-hexanediamine monomer and terephthalic acid, (B) a 0-70 mass% of a reinforced material and/or filler, and (C) a 0-50 mass% additive and/or polymer, provided that (A), (B), and (C) make up 100%, that in component (A) up to 30 mol% terephthtalic acid with respect to the whole dicarboxylic acids can be substituted with another aromatic, aliphatic, or cyclic aliphatic dicarboxylic acid, that in the component (A) up to 30 mol% 1,10-decanediamine and 30 mol% 1,6-hexanediamine with respect to the whole dicarboxylic acids can each be substituted with another diamine, and that in component (A) a portion accounting for not more than 30 mol% with respect to the whole monomers is composed of lactam or amino acid. Furthermore, the use of the polyamide molding composition and the method for producing the polyamide molding composition are also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008274288(A) 申请公布日期 2008.11.13
申请号 JP20080145140 申请日期 2008.05.02
申请人 EMS-PATENT AG 发明人 HEWEL MANFRED
分类号 C08L77/06;C08K3/00 主分类号 C08L77/06
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