| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition which has hydrophobicity suitable for the formation of a fine resist pattern and ensures excellent solubility of its exposed part in an alkali developer in development, and a resist pattern forming method. <P>SOLUTION: The positive resist composition comprises a resin component (A) which comprises a fluorine-containing high molecular compound (A0) having a constitutional unit represented by general formula (a0-1), and of which the solubility in an alkali developer increases by the action of an acid, and an acid generator component (B) which generates an acid upon exposure. <P>COPYRIGHT: (C)2009,JPO&INPIT |
