| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser reflow device that can avoid thermal damage to a surface mounting part and complete soldering for a short time. SOLUTION: The laser reflow device 1 applies a laser light emitted from a laser light source 11 to a printed board P from an irradiation unit 20 to melt solder balls S on the printed board P. Thus, a surface mounting part E having a plurality of terminal portions on the lower side of a body M is soldered onto the printed board P. The irradiation unit 20 includes a light diffusion lens 21 for diffusing a laser light from a laser light source 11. The light diffusion lens 21 diffuses the laser light so that the ratio of an irradiation spot area in the irradiated section to the cross section area of the incident light from the laser light source is greater than 1. Before actual heating for melting the solder balls S, laser light that is formed at larger ratio than that in the actual heating is applied to the upper side of the body M, thus preheating the terminal portions. COPYRIGHT: (C)2009,JPO&INPIT
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