| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring pattern and plating inspection method and an inspection apparatus capable of simultaneously inspecting wiring patterns and platings without being affected by small variations in plating conditions. SOLUTION: The inspection method and the inspection apparatus for inspecting substrates having metal patterns include: a transfer stage for transferring substrates having surface metal patterns made of plated parts and unplated parts; an imaging stage for imaging the surfaces of the substrates from a direction tiled by 0°-10°from the direction of a normal of the substrates while being synchronized with the transfer of the transfer stage; a first illumination stage for illuminating indirect light of light in a wavelength region in which the difference of reflection intensity between the metal materials of the unplated parts of the substrates and the plating materials of the plated parts is maximum; a second illumination stage for illuminating direct light of light in a wavelength region in which the difference of reflection intensity between the metal materials of the unplated parts of the substrates and the plating materials of the plated parts is maximum; and an image processing and defect determination stage for determining defects through the use of image data of the surfaces of the substrates acquired in the imaging stage. COPYRIGHT: (C)2009,JPO&INPIT
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