| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a situation that: a composition for chemical mechanical polishing includes a slurry; a sufficient amount of a selectively oxidizing and reducing compound is provided to produce differential removal of a metal and a dielectric material; and a pH-adjusting compound adjusts the pH of the composition to provide a pH that makes the selectively oxidizing and reducing compound provide the differential removal of a metal and a dielectric material. <P>SOLUTION: A method for chemical mechanical polishing includes applying of a slurry to a surface of a metal and a dielectric material, to produce mechanical removal of the metal and the dielectric material. A selectively oxidizing and reducing compound is applied, to produce the differential removal of the metal and the dielectric material. The slurry and the pH of the selectively oxidizing and reducing compound is adjusted to provide the differential removal of the metal and the dielectric material. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
