| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a thermally conductive mixture employed for preparing a thermally conductive concoction such as a paste having a high thermal conductivity and a relatively low viscosity. <P>SOLUTION: Disclosed is a thermally conductive mixture employed for preparing a thermally conductive concoction such as a paste having a high thermal conductivity and a relatively low viscosity. The paste provides a thermal-conductor connection between electronic parts and a cooling device to increase heat conduction between the parts and a device for cooling the electronic parts. The concoction contains a mixture with thermally conductive particles in various particle-diameter ranges dispersed typically in a non-aqueous dielectric carrier containing an antioxidant and a dispersant, in which the mixture components of thermally conductive particles are correlated in the mixture particularly through volume percentage on a particle-diameter range basis and a particle-diameter ratio for the respective particle-diameter ranges. The mixture may be applied to produce other similar products such as thermal gels, adhesives, slurries and composites, for the products such as electronics and cosmetics, medical agents, and automobiles. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
