发明名称 APPARATUS TREATING A SUBSTRATE USING PLASMA
摘要 The uniformity of plasma density in the housing is improved. Moreover, a deterioration of the plasma uniformity between the adjacent electromagnet can be prevented. The plasma processing apparatus comprises the housing having the space for accommodating substrate; the gas supply member for supplying the gas within the housing; the plasma source for generating the plasma from the gas supplied within the housing; and the magnetic field member for forming the magnetic field on the region in which the plasma is generated in the housing. The magnetic field member comprises the first magnetic unit disposed at the circumference of the housing(420), the second magnetic unit which is disposed at the circumference of the housing, divided into the first magnetic unit and layer(440).
申请公布号 KR20080099750(A) 申请公布日期 2008.11.13
申请号 KR20070045711 申请日期 2007.05.10
申请人 SEMES CO., LTD. 发明人 SHIN TAE HO
分类号 H01L21/205;H01L21/3065 主分类号 H01L21/205
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