| 摘要 |
The method involves positioning a conducting micro-cable (59) in each of through holes associated to corresponding conducting pellets (53, 54), where the micro-cable has a part unrolled over a length greater than/equal to thickness of an integrated circuit support (51) receiving a complementary MOS image sensor. The micro-cable is soldered on the associated pellets, and the micro-cable is adhered on the associated pellets by using an adhesive. The micro-cable is molded on the pellets using resin layers, where the resin layers completely cover the unrolled part of the micro-cable. An independent claim is also included for a head of a cavity exploration device, comprising an integrated circuit support. |
