| 摘要 |
<p>A semiconductor module (2) comprises a housing (8); power semiconductor (12); and integral cooler (6) bearing against a cooling surface, thermally coupled to the power semiconductor, and serving to dissipate heat loss. A spring element, which is supported between housing and cooler, is arranged on a side of the cooler remote from the cooling surface to prestress the cooler against the cooling surface. The spring element is a spring (preferably spiral or leaf spring) or an elastomer element (34) in plate form.</p> |
