| 发明名称 |
Method and apparatus for filling vias |
| 摘要 |
A method for filling vias, and in particular initially blind vias, in a wafer, and various apparatus for performing the method, comprising evacuating air from the vias; trapping at least a portion of the wafer and a paste for filling the vias between two surfaces; and pressurizing the paste to fill the vias.
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| 申请公布号 |
US7449067(B2) |
申请公布日期 |
2008.11.11 |
| 申请号 |
US20030700327 |
申请日期 |
2003.11.03 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
ANDRY PAUL S.;CASEY JON A.;HORTON RAYMOND R.;PATEL CHIRAQ S.;SPROGIS EDMUND J.;SUNDLOF BRIAN R. |
| 分类号 |
B05C1/00;H01L23/12;B05C3/00;B05C3/18;H01L21/48;H01L21/60;H01L21/76;H01L23/14;H01L25/04;H01L25/18;H05K3/34 |
主分类号 |
B05C1/00 |
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代理人 |
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