FILTER CIRCUIT ELEMENT AND ELECTRONIC CIRCUIT DEVICE

摘要

A plurality of vias are adjacently arranged on a multilayer substrate, one outer side first via among the vias is electrically connected to a first extraction line arranged on the multilayer substrate, and the other outer side second via is electrically connected to a second extraction line arranged on the multilayer substrate. The vias are connected to a first fixed potential layer (for instance, a ground layer) of the multilayer substrate. Between the first and second extraction lines and the fixed potential layer, at least one layer of a second fixed potential layer at a potential same as that of the first fixed potential layer is arranged as an inner layer of the multilayer substrate through the vias and a clearance. Thus, a BPF having a low area occupancy is formed on the multilayer substrate without adding an extra manufacturing step.