| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module unit capable of improving cooling efficiency and furthermore reducing the mounting height. SOLUTION: The semiconductor module unit is formed by covering the upper surface of a substrate 2, on which a plurality of heating elements 1 are mounted, with a heat dissipation plate 3 serving as a support frame 19 of the substrate 2. A plurality of heat-radiating fins 4 are protruded on the heat dissipation plate 3, heat pipe support grooves 16 are formed on a base-end surface 15 of the heat-radiating fins of the heat dissipation plate 3 at the same time, and a mounting members 17 of a cooling fan device 7 are formed on the heat dissipating plate 3. COPYRIGHT: (C)2009,JPO&INPIT
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