| 摘要 |
PROBLEM TO BE SOLVED: To obtain the transfer of an intermediate mold with a simple and inexpensive constitution. SOLUTION: A resin sealing device comprises an upper mold 12, a lower mold 13 relatively contactable/separable with respect to the upper mold 12, and an intermediate mold 14 detachably disposed on the lower mold 13. Electronic components mounted on a substrate 9 are resin-sealed by holding the substrate 9 between the lower mold 13 and the intermediate mold 14 and casting the resin into a cavity formed by the substrate 9 placed on the lower mold 13 and a recess 27 of the intermediate mold 14. The resin sealing device is equipped with a transfer means for transferring the lower mold 13 to a molding position opposing to the upper mold 12, and a non-molding position moved to the side part, and a control means 46 which drives and controls the transfer means in such a state that the intermediate mold 14 is placed on the lower mold 13 after molding at the molding position, and conveys the intermediate mold 14 and the lower mold 13 to the non-molding position. COPYRIGHT: (C)2009,JPO&INPIT
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