| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition which improves pattern collapse even in the formation of a fine pattern of ≤100 nm and a pattern forming method using the same, with respect to a positive photosensitive composition for use in the production process of a semiconductor such as IC, in the production of a circuit board of liquid crystal, thermal head and the like or in other photofabrication processes and a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition comprises (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation, and (B) a resin which has a repeating unit (B1) having a tertiary ester group substituted by an alkoxycarbonyl group, and decomposes by the action of an acid to increase its solubility in an alkali developer. The pattern forming method using the same is also provided. <P>COPYRIGHT: (C)2009,JPO&INPIT |
