| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated substrate that efficiently releases the heat generated from electronic components, allowing the size increase thereof to be as small as possible. <P>SOLUTION: The laminated substrate 1, where a plurality of substrates forming a circuit pattern comprising a conductive layer on an insulating board, includes a signal substrate 11, on which a signal circuit pattern to mount FET having a heat-emitting drain terminal is formed; a power supply substrate 12 on which a power supply pattern 121 connected to a power supply; and a ground substrate 13 on which a ground pattern 130 connected to the ground is formed. A heat release pattern that is not only connected to the heat emitting terminal but is also electrically independent of the power supply pattern is formed on the power supply board. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
