发明名称 Hard-Soldering Method and Device
摘要 To hard-solder parts to be joined along a common joint, the parts are heated by a heat source e.g. a laser beam ( 3 ). Melted solder ( 7 ) that is stored in a container ( 6 ) is then introduced into the joint. Joints can be filled with solder in this manner at higher speed and the solidified solder surface is practically devoid of pores, thus permitting the priming or painting of said parts without the need for subsequent treatment.
申请公布号 US2008272112(A1) 申请公布日期 2008.11.06
申请号 US20050628093 申请日期 2005.05.20
申请人 SOUTEC SOUDRONIC AG 发明人 URECH WERNER
分类号 B23K1/002;B23K1/005;B23K3/03;B23K3/047;B23K3/06;B23K3/08;B23K5/00;B23K9/00;B23K26/20;B23K31/02 主分类号 B23K1/002
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