| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with a built-in inductor which is easy in thickening the film, and has low resistance. <P>SOLUTION: The substrate with a built-in inductor comprises a substrate 30, an inductor 12 bonded on the substrate 30, and wiring layers 40-44 connected electrically to a first connection part A on one end side of the inductor 12 and to a second connection part B on the other end side, respectively. The thickness of the inductor 12 is set to be thicker than those of the wiring layers 40-44. The inductor 12 is formed by bonding an inductor member 12a obtained by press-working with a metal plate 10 to the substrate 30 using an adhesive layer 14. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
