| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier manufacturing method capable of obtaining sufficient connection even when copper plating in an inter-layer connection portion is not thickly protruded. SOLUTION: A pattern for forming vias is formed by photo-etching on one or both the surfaces of copper layers 3 of a polyimide film 1 where the copper layers are included on both the surfaces and an adhesive is not used for bonding with the copper layers 3. With the pattern as a mask, blind vias 9 are formed by laser. Thereafter, a wiring pattern is formed by photo-etching. After masking portions unnecessary for connecting the copper layers, internal portions of the blind vias are filled with plating 14 by depositing the plating 14 from bottom faces of the vias without performing conducting process on side faces of the vias, to obtain electric connection with the upper copper layer. When the above double-sided wiring tape carrier is manufactured, the upper copper layer is chemically ground before plating. COPYRIGHT: (C)2009,JPO&INPIT
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