发明名称 |
POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition with improved line edge roughness due to normal exposure and immersion exposure and excellent followability to water during immersion exposure, and a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound generating an acid in irradiation with active light or radiation; (C) a resin that contains neither fluorine nor silicon and has a repeating unit having the predetermined structure; and (D) a solvent, wherein each symbol represents a predetermined group or the like. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008268933(A) |
申请公布日期 |
2008.11.06 |
申请号 |
JP20080076600 |
申请日期 |
2008.03.24 |
申请人 |
FUJIFILM CORP |
发明人 |
FUKUHARA TOSHIAKI;KANNA SHINICHI;KANDA HIROMI |
分类号 |
G03F7/039;C08F20/28;C08F210/14;C08F212/04;C08F216/14;C08F220/20;C08F222/40;G03F7/004;G03F7/023;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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