发明名称 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist composition with improved line edge roughness due to normal exposure and immersion exposure and excellent followability to water during immersion exposure, and a pattern forming method using the same. <P>SOLUTION: The positive photosensitive composition comprises: (A) a resin that has an acid decomposable repeating unit represented by formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound generating an acid in irradiation with active light or radiation; (C) a resin that contains neither fluorine nor silicon and has a repeating unit having the predetermined structure; and (D) a solvent, wherein each symbol represents a predetermined group or the like. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008268933(A) 申请公布日期 2008.11.06
申请号 JP20080076600 申请日期 2008.03.24
申请人 FUJIFILM CORP 发明人 FUKUHARA TOSHIAKI;KANNA SHINICHI;KANDA HIROMI
分类号 G03F7/039;C08F20/28;C08F210/14;C08F212/04;C08F216/14;C08F220/20;C08F222/40;G03F7/004;G03F7/023;H01L21/027 主分类号 G03F7/039
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