发明名称 SEMICONDUCTOR WAFER'S MANUFACTURING APPARATUS
摘要 <p>The semiconductor wafer processing system is provided to prevent the contamination of the lower part bottom surface of wafer and the support stand due to developer. The semiconductor wafer processing system includes the driving unit(4) in which the support stand(2) fixing the semiconductor wafer is connected; the protection element(6) in which the support stand is connected through the central part; the cut off block(8) spraying the cooling gas and cools the support stand and semiconductor wafer; the supply part of cooling gas supplying the cooling gas to the cut off block. The cut off block is mounted on the central part of the protection element and is installed at the lower part of the support stand.</p>
申请公布号 KR20080097727(A) 申请公布日期 2008.11.06
申请号 KR20070042939 申请日期 2007.05.03
申请人 CND PLUS CO., LTD. 发明人 YOO, YONG SU;KIM, JONG HO;KIM, SUNG MIN
分类号 H01L21/027 主分类号 H01L21/027
代理机构 代理人
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