发明名称 |
SEMICONDUCTOR WAFER'S MANUFACTURING APPARATUS |
摘要 |
<p>The semiconductor wafer processing system is provided to prevent the contamination of the lower part bottom surface of wafer and the support stand due to developer. The semiconductor wafer processing system includes the driving unit(4) in which the support stand(2) fixing the semiconductor wafer is connected; the protection element(6) in which the support stand is connected through the central part; the cut off block(8) spraying the cooling gas and cools the support stand and semiconductor wafer; the supply part of cooling gas supplying the cooling gas to the cut off block. The cut off block is mounted on the central part of the protection element and is installed at the lower part of the support stand.</p> |
申请公布号 |
KR20080097727(A) |
申请公布日期 |
2008.11.06 |
申请号 |
KR20070042939 |
申请日期 |
2007.05.03 |
申请人 |
CND PLUS CO., LTD. |
发明人 |
YOO, YONG SU;KIM, JONG HO;KIM, SUNG MIN |
分类号 |
H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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