| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device having a first lead on which an optical semiconductor chip being mounted and a second lead to which a wire extending from the optical semiconductor chip mounted on the first lead being joined, and capable of reducing the possibility of disconnection of the wire even when it is subjected to a thermal shock etc. <P>SOLUTION: The device has the first lead 3 on which the optical semiconductor chip 2 being mounted, the second lead 4 to which the wire (e.g. a gold line) 5 extending from the optical semiconductor chip 2 mounted on the first lead 3 being joined, a holder portion 6 for supporting each of the first lead 3 and the second lead 4 at two points, a lens portion 7, and a light transmissive sealing portion 8. The second lead 4 is separated into two lead pieces 4a, 4b having a predetermined width d (≠0) inside the holder portion 6 supporting the second lead 4 at the two points. <P>COPYRIGHT: (C)2009,JPO&INPIT |
