发明名称 Method of Assembling Electronic Components of an Electronic System, and System Thus Obtained
摘要 An electronic system comprising: an electronic system support substrate for the attachment of components of the electronic system, the electronic system support substrate including electric signal propagation paths for the propagation of electric signals between the system components; at least a first and a second electronic components, wherein at least the first electronic component is part of a module in mechanical and electrical connection with the electronic system support substrate, the module comprising a module substrate to which the first electronic component is at least mechanically connected, and an electric coupling between the first and the second electronic components, for the electric coupling allowing the first and the second electronic components exchange of electric signals. The electric coupling comprises a direct electric connection, particularly formed by a flexible electrical interconnection member, between the first and the second electronic components, the electric connection being independent of the electronic system support substrate.
申请公布号 US2008274587(A1) 申请公布日期 2008.11.06
申请号 US20080137164 申请日期 2008.06.11
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 OFFREIN BERT J.;OGGIONI STEFANO S.;SPREAFICO MAURO
分类号 H01L21/58 主分类号 H01L21/58
代理机构 代理人
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