发明名称 |
COOLING COMPONENTS IN ELECTRONIC DEVICES |
摘要 |
<p>Various embodiments are directed to cooling heat generating components. In one embodiment, a method cools a heat generating component in an electronic device below an ambient temperature to produce condensation (110). Heat is transferred from the heat generating component to a thermal dissipation device (130), and the condensation is dispensed onto a thermal dissipation device to cool the thermal dissipation device (140).</p> |
申请公布号 |
WO2008133998(A1) |
申请公布日期 |
2008.11.06 |
申请号 |
WO2008US05364 |
申请日期 |
2008.04.24 |
申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;SZOLYGA, THOMAS, H. |
发明人 |
SZOLYGA, THOMAS, H. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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