| 摘要 |
A light-emitting device and a method for fabricating same are provided to easily manufacture by efficiently release the heat generated from the device. The sub mount member is comprised by mounting the LED chip(11) on the sub mount(12) and forming the sub mount electrode(14a,14b). The luminous unit(20) is comprised by mounting the sub mount member on the flat substrate. Lead frame member(30) having lead frame electrode(31a and 31b) are comprised by the lead frame and resin mold material. By overlapping the electrodes of luminous units and lead frame member with each other, the light emitted diode is manufactured. |
