发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible copper clad laminated sheet capable of being utilized as an electronic part such as a printed board, a flexible printed board or the like excellent in peel strength and heat resistance and easy to handle. <P>SOLUTION: A polyimide precursor resin solution is applied to a copper foil with a surface roughness Ra of 0.08-0.60 and the coated copper foil is dried so that the residual solvent of the applied polyimide precursor resin solution becomes 10-80 mass% to laminate a polyimide film on the polyimide precursor resin solution. Thereafter, the polyimide precursor resin is imidated to manufacture the flexible copper clad laminated sheet. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP4174676(B2) 申请公布日期 2008.11.05
申请号 JP20040138293 申请日期 2004.05.07
申请人 发明人
分类号 B32B15/088;H05K1/09;B32B15/08;B32B37/00 主分类号 B32B15/088
代理机构 代理人
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