| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a power semiconductor package having a small size and high reliability. <P>SOLUTION: A power semiconductor package 100 having a plurality of leads 1 protruded from a mold resin 6 comprises: a first lead 1a including a first die pad 1b; power chips 2 mounted to the surface of the first die pad; a second lead 1c including a second die pad; a control chip 3 mounted to the second die pad; a wire 4 whose main component is gold and which connects the power chips with the control chip; and the mold resin in which the first lead and the second lead are embedded with their ends protruded outwardly, wherein the first end of the wire is ball-bonded to the control chip, and the second end is stitch-bonded to a power chip. <P>COPYRIGHT: (C)2009,JPO&INPIT |
