| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-conductive resin paste having high heat conductivity, keeping prescribed softness even after cure polymerization and having low viscosity before curing and to provide an optical disk device produced by using the paste. <P>SOLUTION: The heat-conductive resin paste 100 comprises a curable base resin and particles of a heat-conductive substance. The curable base resin is produced by compounding a bifunctional group epoxy monomer and a monofunctional group epoxy monomer at a weight ratio of about 1:3 and cleaving the polymer chain, and the heat-conductive substance contains aluminum nitride particles and two kinds of aluminum oxide particles having different diameters, the average particle diameter of the aluminum nitride particle is ≥40 μm or thereabout, the average particle diameter of the aluminum oxide particle having larger diameter is about 10 μm, the average particle diameter of the aluminum oxide particle having smaller diameter is about 0.5 μm, the compounding weight ratios of the aluminum nitride particle, the aluminum oxide particle having larger diameter and the aluminum oxide particle having smaller diameter are about 5:5:1, and the compounding weight ratio of the curable base resin to the heat-conductive substance particle is set to about 1:11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
