| 发明名称 |
Marks for the Alignment of Wafer-Level Underfilled Silicon Chips and Method to Produce Same |
| 摘要 |
A semiconductor wafer and the process for aligning wafer level underfill material coated chips with a substrate via alignment marks made visible through laser dicing.
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| 申请公布号 |
US2008265445(A1) |
申请公布日期 |
2008.10.30 |
| 申请号 |
US20070742200 |
申请日期 |
2007.04.30 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
FEGER CLAUDIUS;LABIANCA NANCY |
| 分类号 |
H01L21/58;H01L23/544 |
主分类号 |
H01L21/58 |
| 代理机构 |
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代理人 |
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| 主权项 |
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