THE FABRICATION METHOD OF OPENED HOLE POROUS SILICON MEMBRANE

摘要

An opened hole porous silicon membrane can be used in the field including a porous high temperature film by forming an opened hole structure while having a thick thickness as compared with the conventional silicon membrane. An opened hole porous silicon membrane is produced by electrochemically reacting non-porous silicon with an etchant. The non-porous silicon is used in a thickness range of 100 ~ 480 ‘í, and the etchant is a mixture of hydrofluoric acid(HF) and dimethylformamide(DMF) in a weight ratio of 1 ~ 3 : 7 ~ 9. The electrochemical reaction is performed at 0 - 50 deg.C for 40min ~4hr under the conditions of 10 ~ 100 mA constant current, and 110 ~ 250 Фcm surface resistance.