| 摘要 |
<p>SEMICONDUCTOR ETCH RESIDUE REMOVER AND CLEANSING COMPOSITIONS An aqueous and semi-aqueous formulation useful for removing post etch and ash residue from Cu low K dielectric semiconductor devises. The composition comprises a polycarboxylic acid buffering system, a fluoride system, water, a water miscible organic solvent for the said aqueous compositions and optionally a chelating agent, a metal corrosion inhibitor and a surfactant.</p> |
