CIRCUIT BOARD ASSEMBLY HAVING SEMICONDUCTOR CHIP, ELECTRIC ASSEMBLY USING THE CIRCUIT BOARD ASSEMBLY, AND INFORMATION PROCESSING SYSTEM USING THE ELECTRIC ASSEMBLY

摘要

PROBLEM TO BE SOLVED: To provide a combination of boards and internal chips by which a relatively complicated final structure can be manufactured without significantly increasing cost by using a number of known PCB manufacturing processes.

SOLUTION: A circuit board assembly 51 comprises at least two circuit boards 11 each partially including a thin insulator layer 13 and a conductive layer 21 having a plurality of conductive members 17. The conductive members 17 of each board 11 are electrically connected to conductive portions 33 of a semiconductor chip 31. An insulator layer 53 is disposed between the boards 11, and the boards 11 are joined to each other in the stacking direction with the chips 31 disposed in the assembly 51.

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