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发明名称
Chip component mounting structure, chip component mounting method, and electronic device
摘要
A chip component mounting structure is provided that has a chip component surface mounted on a pair of electrodes formed on a substrate. The electrodes have differing areas, and the chip component and t.
申请公布号
US2008266827(A1)
申请公布日期
2008.10.30
申请号
US20080216153
申请日期
2008.06.30
申请人
FUJITSU LIMITED
发明人
YOKOZAWA HIROSHI
分类号
H05K7/02
主分类号
H05K7/02
代理机构
代理人
主权项
地址
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