发明名称 Chip component mounting structure, chip component mounting method, and electronic device
摘要 A chip component mounting structure is provided that has a chip component surface mounted on a pair of electrodes formed on a substrate. The electrodes have differing areas, and the chip component and t.
申请公布号 US2008266827(A1) 申请公布日期 2008.10.30
申请号 US20080216153 申请日期 2008.06.30
申请人 FUJITSU LIMITED 发明人 YOKOZAWA HIROSHI
分类号 H05K7/02 主分类号 H05K7/02
代理机构 代理人
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