| 发明名称 |
FLOW FRONT AND MOLD BLEED CONTROL SYSTEM AND METHOD |
| 摘要 |
<p>Flow Front and Mold Bleed Control Method and Apparatus The present invention provides a molding method and apparatus for encapsulating semiconductors with flow front and mold bleed control. The method and apparatus operable to provide pressures into mold cavities while encapsulant compound is flowing into the mold cavities.</p> |
| 申请公布号 |
SG146495(A1) |
申请公布日期 |
2008.10.30 |
| 申请号 |
SG20070026263 |
申请日期 |
2007.04.10 |
| 申请人 |
ADVANCED SYSTEMS AUTOMATION LTD |
发明人 |
KHIM HENG HING;SOON LIM ENG;HOCK LIM KIAN |
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