| 摘要 |
PROBLEM TO BE SOLVED: To provide thin film self-organizing technology of a polyimide base capable of reducing costs and simplifying and miniaturizing a manufacturing process. SOLUTION: Self-organization of a microstructure is completed by (1) evaporating a consumable layer 20 and a low stress microstructure layer 30 on a silicone substrate 10, (2) furnishing a stationary part and a movable part of the microstructure by patterning and etching the low stress microstructure layer, (3) covering it with a photosensitive polyimide thin film as an elastic connecting part 41 of the microstructure layer and demarcating the shape by using photo lithography technology, (4) removing the consumable layer below the movable part of the microstructure layer by wet etching and (5) contracting the elastically connected part by proceeding a reflowing process of polyimide, rotating the movable part and lifting it at last. COPYRIGHT: (C)2009,JPO&INPIT
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