| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting pad (tool) to use when annealing a printed wiring board that not only solves a problem of warpage caused in the printed wiring board when annealed but also causes no effect on electronic components soldered thereon. SOLUTION: The mounting pad includes a support pin A6 wherein a magnet 9 is disposed above a hollow bottom of a cylindrical portion 14, a support pin B7 without a magnet, and a press-fit pin 8 comprised of a magnetic material. In the mounting pad, the printed wiring board 1 is supported by two types of support pins, and the press-fit pin 8 is penetrated with a hole portion 10 formed therein. Additionally, the printed wiring board is held by an edge of the press-fit pin 8 and power of the magnet 9 above the bottom of the support pin A. This results in not only fixing the printed wiring board annealed with stronger energy but also preventing the warpage caused therein without generating stress thereto as well as causing no effect on the electronic components soldered thereon. COPYRIGHT: (C)2009,JPO&INPIT |
