| 摘要 |
PROBLEM TO BE SOLVED: To provide a film thickness measuring method for improving measurement precision of film thickness, and to provide a method of manufacturing a magnetic device. SOLUTION: The film thickness measuring method forms a laminated film L0 by integrating an adhesion layer L1 comprising film thickness T1 on a substrate S including a mask pattern M by forming the mask pattern M on the substrate S, a measuring object layer Lm, and a protection layer L2 comprising film thickness T2 by having higher mechanical strength than the measuring object layer Lm in order. The film thickness measuring method forms a step part 10 on the laminated film L0 by lifting off the mask pattern M and obtains film thickness Tm of the measuring object layer Lm as Tm=T0-(T1+T2) by measuring depth T0 of the step part 10 by a stylus method. COPYRIGHT: (C)2009,JPO&INPIT
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