| 发明名称 |
NEW PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM AND INSULATING FILM OBTAINED FROM THE SAME AND PRINTED WIRING BOARD WITH INSULATING FILM |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition which has good photosensitive function and basic properties as an electrical insulating material and ensures small warpage of a flexible printed wiring board or the like when applied on one surface of a soft substrate of the printed wiring board or the like. <P>SOLUTION: The photosensitive resin composition includes at least (A) a siloxane imide oligomer terminated by a tetracarboxylic acid, (B) a diamino compound, (C) a photopolymerization initiator and (D) a dipentaerythritol base (meth)acrylate. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2008261920(A) |
申请公布日期 |
2008.10.30 |
| 申请号 |
JP20070102721 |
申请日期 |
2007.04.10 |
| 申请人 |
KANEKA CORP |
发明人 |
SEKITO YOSHIHIDE;FUJIWARA HIROSHI;OGISO TETSUYA |
| 分类号 |
G03F7/075;C08F2/44;C08G59/58;C08G73/10;G03F7/004;G03F7/027;G03F7/037;H05K3/28 |
主分类号 |
G03F7/075 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
