发明名称 EVAPORATIVE COOLING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an evaporative cooling device capable of uniformly evaporatively cooling the entire cooling chamber. SOLUTION: A jacket portion 2 is mounted at an outer periphery of a reaction pot 1. A cooling fluid pipe conduit 6 is arranged in the jacket portion 2. A plurality of cooling fluid injection nozzles 25 for injecting the cooling fluid to an outer surface of the reaction pot 1 are mounted at a reaction pot 1 side of the cooling fluid pipe conduit 6. The nozzles 25 are respectively composed of a cooling fluid spray port 29 and upper and lower boundary portion cooling fluid spray ports 27, 28. In a case of cooling the reaction pot 1, the cooling fluid is injected from the cooling fluid injection nozzles 25 into the jacket portion 2, thus the cooling fluid is evenly supplied to the entire outer surface of the reaction pot 1, and the entire reaction pot 1 can be uniformly evaporatively cooled. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008261594(A) 申请公布日期 2008.10.30
申请号 JP20070105870 申请日期 2007.04.13
申请人 TLV CO LTD 发明人 HARA NOBUHIDE
分类号 F25D7/00 主分类号 F25D7/00
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