发明名称 LED REFLECTOR MOLDING PROCESS, CONSTRUCTION, AND LOADER THEREOF
摘要 The method involves providing a blank, which includes an opening. Another blank has another opening, which is smaller than the former opening and provided over the former opening, where the latter blank lies on the former blank. A metallic layer is applied on the former blank. The latter blank is deformed and covers the former blank within area of the former opening by heat forming or pressing. A heat form is utilized for pressing. Independent claims are also included for the following: (1) a reflection layer for a light emitting diode (2) a light emitting diode carrier with a ceramic coating.
申请公布号 KR100865835(B1) 申请公布日期 2008.10.29
申请号 KR20070024553 申请日期 2007.03.13
申请人 发明人
分类号 H01L33/00;H01L33/12;H01L33/60;H01L33/62 主分类号 H01L33/00
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