发明名称 |
Thin ball grid array package |
摘要 |
An integrated circuit package is provided. The package includes a substrate having first and second surfaces and a plurality of conductive traces therebetween. The substrate further has a cavity therein and a heat slug is fixed to the substrate and spans the cavity. A semiconductor die is mounted to the heat slug such that at least a portion of the semiconductor die is disposed in the cavity. A plurality of wire bonds connect the semiconductor die to ones of the conductive traces of the substrate and an encapsulating material encapsulates the wire bonds and the semiconductor die. A ball grid array is disposed on the first surface of the substrate. Bumps of the ball grid array are in electrical connection with ones of the conductive traces.
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申请公布号 |
US7439099(B1) |
申请公布日期 |
2008.10.21 |
申请号 |
US20030678417 |
申请日期 |
2003.10.03 |
申请人 |
ASAT LTD. |
发明人 |
FAN CHUN HO;TSANG KWOK CHEUNG;CHOW WILLIAM LAP KEUNG |
分类号 |
H01L21/48;H01L23/31;H01L23/36;H01L23/433;H01L25/10 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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