发明名称 |
Component mounting method |
摘要 |
A component mounting apparatus and method for mounting a plurality of components on a board. The aparatus is provided with a board holding device for holding the board at a board holding position, a first mounting head for holding and taking out a component fed from a first component feeding position and mounting the component on the board held at the board holding position, a second mounting head for holding and taking out the component fed from a second component feeding position and mounting the component on the held board, and a component feeding device having a wafer holding table for holding a wafer on which the respective components are fed so that the wafer holding table can be moved reciprocationally between the first component feeding position and the second component feeding position.
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申请公布号 |
US7437818(B2) |
申请公布日期 |
2008.10.21 |
申请号 |
US20040564275 |
申请日期 |
2004.08.25 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KABESHITA AKIRA;HAMASAKI KURAYASU;TANI NORIYUKI;MINAMITANI SHOZO;MAKINO YOICHI |
分类号 |
H05K3/30;H05K13/04;H01L21/00;H01L21/52;H01L21/67 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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