发明名称 LASER WELDING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser welding method for efficiently performing welding. <P>SOLUTION: In this laser welding method, a first and a second semiconductor laser beam L1, L2 are emitted along the planned welding line SS of members 10, 11. The first semiconductor laser beam L1 has a shorter wavelength compared with the second semiconductor laser beam L2 and an absorption factor in the members 10, 11 is higher accordingly. By the first semiconductor laser beam L1 having the higher absorption factor, the surface of the members 10, 11 is quickly activated and fused. In this invention, in a manner following up the first semiconductor laser beam L1, the second semiconductor laser L2 is emitted, so that the members 10, 11 with the surface activated are irradiated with the second semiconductor laser beam L2. In the members 10, 11, activation is promoted by such second semiconductor laser beam L2, and fusion smoothly advances to the inside of the members 10, 11. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008246502(A) 申请公布日期 2008.10.16
申请号 JP20070088619 申请日期 2007.03.29
申请人 TOKYU CAR CORP 发明人 OTSUKA YOSUKE;KAWADA NAOKI;IWAKI SHUNICHI
分类号 B23K26/20;B23K26/06 主分类号 B23K26/20
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