发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND CURED FILM FORMING METHOD USING THE SAME |
摘要 |
<p>A positive photosensitive resin composition, includes: (A) a resin containing an acid-dissociable group having a specific acetal structure as defined in the specification, which is alkali-insoluble or sparingly alkali-soluble and becomes alkali-soluble when the acid-dissociable group is dissociated; (B) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (C) a crosslinking agent; and (D) an adhesion aid, and a cured film forming method uses the same.</p> |
申请公布号 |
WO2008123563(A1) |
申请公布日期 |
2008.10.16 |
申请号 |
WO2008JP56626 |
申请日期 |
2008.03.27 |
申请人 |
FUJIFILM CORPORATION;TAKITA, SATOSHI |
发明人 |
TAKITA, SATOSHI |
分类号 |
G03F7/039;G03F7/004;G03F7/075;G03F7/40 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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