| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which can broaden the bus width, with respect to connection between chips and transmit signals at a high speed, and to provide its manufacturing method at low cost. <P>SOLUTION: A first semiconductor element 1 is embedded in a first insulating material 2; a second semiconductor element 5 is covered with a second insulating material 6; a connecting electrode 4 is embedded in the first insulating material 2, disposed in between a circuit surface of the first semiconductor element 1 and a circuit surface of the second semiconductor element 5; a terminal 8 for external connection is provided on the lower surface of the first insulating material 2, with the lower surface being in the same direction as the lower surface of the first semiconductor element 1 on the opposite side to the circuit surface of the first semiconductor element 1. The connecting electrode 4 makes conductive the circuit surface of the first semiconductor element 1 and the circuit surface of the second semiconductor element 5, and the first semiconductor element 1 and the terminal 8 for external connection are made conductive via an interconnection 3 that passes through a region other than the region where the connecting electrode 4 is embedded and a via 7. <P>COPYRIGHT: (C)2009,JPO&INPIT |
