发明名称 CONNECTION METHOD OF INTEGRATED CIRCUIT TO SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent occurrence of a situation where pressurization of a press-fitting member, such as a press-fitting head to an integrated circuit, such as, driver IC does not become uniform. SOLUTION: Timing when bumps arranged in a plurality of prescribed positions in driver IC are conducted with an electrode pattern formed in a first substrate 11 of a liquid display panel, after the press-fitting head 50 is brought into contact with driver IC, is detected via monitor terminals 141, 142, 143, 144, 145, 146, 147 and 148. First timing, when the bump is connected with the electrode pattern the earliest among detected timings and a time difference from first timing to other timing are calculated. Balancing degree adjusting cylinders 51a, 51b, 51c and 51d are controlled so that the contact time of the press-fitting head 50, to a position where the bump is conducted with the electrode pattern later than first timing, is made earlier. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251828(A) 申请公布日期 2008.10.16
申请号 JP20070091155 申请日期 2007.03.30
申请人 OPTREX CORP 发明人 EGUCHI NOBORU
分类号 H01L21/60;H05K3/32 主分类号 H01L21/60
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